Structural Hot-Spot Stress Approach to Fatigue Analysis of Welded Components : Designer's Guide
2nd ed. 2018
Book Details
Format
Hardback or Cased Book
Book Series
IIW Collection
ISBN-10
981105567X
ISBN-13
9789811055676
Edition
2nd ed. 2018
Publisher
Springer Verlag, Singapore
Imprint
Springer Verlag, Singapore
Country of Manufacture
SG
Country of Publication
GB
Publication Date
Sep 6th, 2017
Print length
76 Pages
Ksh 19,800.00
Werezi Extended Catalogue
0 in stock
Delivery Location
Delivery fee: Select location
Secure
Quality
Fast
This book provides background and guidance on the use of the structural hot-spot stress approach to fatigue analysis.
This book provides background and guidance on the use of the structural hot-spot stress approach to fatigue analysis. The book also offers Design S-N curves for use with the structural hot-spot stress for a range of weld details, and presents parametric formulas for calculating stress increases due to misalignment and structural discontinuities.
Highlighting the extension to structures fabricated from plates and non-tubular sections. The structural hot-spot stress approach focuses on cases of potential fatigue cracking from the weld toe and it has been in use for many years in tubular joints.
Following an explanation of the structural hot-spot stress, its definition and its relevance to fatigue, the book describes methods for its determination. It considers stress determination from both finite element analysis and strain gauge measurements, and emphasizes the use of finite element stress analysis, providing guidance on the choice of element type and size for use with either solid or shell elements. Lastly, it illustrates the use of the recommendations in four case studies involving the fatigue assessment of welded structures using the structural hot-spot stress
Get Structural Hot-Spot Stress Approach to Fatigue Analysis of Welded Components by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Springer Verlag, Singapore and it has pages.
