Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments has cutting-edge information on how to design, analyze, and test in the small satellite environment.

Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, analyze, and test in the fast-paced and low-cost small satellite environment. It also presents techniques to reduce the design and test cycles without compromising reliability. Further, the book serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for designing spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. Provides updates throughout and includes an all-new chapter on Reliability. Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flying the first CubeSat to Mars. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, as well as the surfaces of Mars and Venus.