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Thermal Design of Electronic Equipment

By: USA) Remsburg California Irvine Ralph (Opvista (Author) , USA) Dorf Davis Richard C. (University of California (Author)

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Ksh 40,800.00

Format: Hardback or Cased Book

ISBN-13: 9780849300820

Publisher: Taylor & Francis Inc

Publication Date: Sep 27th, 2000

Weight: 732 grams

Dimension: 16.80 x 24.10 x 2.80 cms

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Presents the formulas used by electronic packaging and thermal engineers. This book presents heat transfer equations dealing with polyalphaolephin, silicone oils, perfluorocarbons, and silicate ester-based liquids. It presents empirical formulas and practical techniques that lets you solve thermal engineering problem in electronic packaging.

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