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Thermal Spreading and Contact Resistance
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Thermal Spreading and Contact Resistance : Fundamentals and Applications

Book Details

Format Hardback or Cased Book
ISBN-10 1394187521
ISBN-13 9781394187522
Publisher John Wiley & Sons Inc
Imprint Sybex Inc.,U.S.
Country of Manufacture US
Country of Publication GB
Publication Date Aug 9th, 2023
Print length 464 Pages
Weight 1,032 grams
Dimensions 18.70 x 26.30 x 3.10 cms
Product Classification: Mechanical engineering & materials
Ksh 19,100.00
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Thermal Spreading and Contact Resistance: Fundamentals and Applications Single source reference on how applying thermal spreading and contact resistance can solve problems across a variety of engineering fields Thermal Spreading and Contact Resistance: Fundamentals and Applications offers comprehensive coverage of the key information that engineers need to know to understand thermal spreading and contact resistance, including numerous predictive models for determining thermal spreading resistance and contact conductance of mechanical joints and interfaces, plus detailed examples throughout the book. Written by two of the leading experts in the field, Thermal Spreading and Contact Resistance: Fundamentals and Applications includes information on: Contact conductance, mass transfer, transport from super-hydrophobic surfaces, droplet/surface phase change problems, and tribology applications such as sliding surfaces and roller bearingsHeat transfer in micro-devices and thermal spreaders, orthotropic systems, and multi-source applications for electronics thermal management applicationsFundamental principles, thermal spreading in isotropic half-space regions, circular flux tubes and disc spreaders, and rectangular flux channels and compound spreadersSystems with non-uniform sink plane conductance, transient spreading resistance, and contact resistance between both non-conforming and conforming rough surfaces Providing comprehensive coverage of the subject, Thermal Spreading and Contact Resistance: Fundamentals and Applications is an essential resource for mechanical, aerospace, and chemical engineers working on research in the fields of heat transfer, thermal management of electronics, and tribology, as well as thermal engineers and researchers in the field of thermal physics.

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