Three-Dimensional Integration of Semiconductors : Processing, Materials, and Applications
Softcover reprint of the original 1st ed. 2015
Book Details
Format
Paperback / Softback
ISBN-10
3319792555
ISBN-13
9783319792552
Edition
Softcover reprint of the original 1st ed. 2015
Publisher
Springer International Publishing AG
Imprint
Springer International Publishing AG
Country of Manufacture
CH
Country of Publication
GB
Publication Date
Mar 28th, 2019
Print length
408 Pages
Ksh 23,400.00
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This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Get Three-Dimensional Integration of Semiconductors by at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Springer International Publishing AG and it has pages.
