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Through Silicon Vias

By: India) Kaushik Uttareakhand Brajesh Kumar (Indian Institute of Technology Roorkee (Author) , Vobulapuram Ramesh Kumar (Author) , India) Majumder Chhattisgarh Manoj Kumar (IIIT (Author)

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Ksh 10,800.00

Format: Paperback or Softback

ISBN-13: 9780367574543

Publisher: Taylor & Francis Ltd

Publication Date: Jun 30th, 2020

Dimension: 23.40 x 15.60 x 42.60 cms

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Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

Get Through Silicon Vias by Brajesh Kumar (Indian Institute of Technology Roorkee, Uttareakhand, India) Kaushik at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by Taylor & Francis Ltd and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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