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Through Silicon Vias
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Through Silicon Vias : Materials, Models, Design, and Performance

by Arsalan Alam , Brajesh Kumar Kaushik , Manoj Kumar Majumder , Vobulapuram Ramesh Kumar

Book Details

Format Paperback / Softback
ISBN-10 0367574543
ISBN-13 9780367574543
Publisher Taylor & Francis Ltd
Imprint CRC Press
Country of Manufacture GB
Country of Publication GB
Publication Date Jun 30th, 2020
Print length 216 Pages
Weight 453 grams
Product Classification: Nanotechnology Semi-conductors & super-conductors
Ksh 9,350.00 Werezi Extended Catalogue

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Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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