Wireless Interface Technologies for 3D IC and Module Integration
Book Details
Format
Hardback or Cased Book
ISBN-10
110884121X
ISBN-13
9781108841214
Publisher
Cambridge University Press
Imprint
Cambridge University Press
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Sep 30th, 2021
Print length
336 Pages
Weight
752 grams
Dimensions
25.10 x 17.70 x 2.40 cms
Product Classification:
Circuits & componentsElectronics: circuits and components
Ksh 24,650.00
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Synthesising fifteen years of research, this comprehensive text provides a treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, and practical considerations. An essential resource for researchers, professional engineers and graduate students.
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.
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