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Wireless Interface Technologies for 3D IC and Module Integration

By: Tadahiro (University of Tokyo) Kuroda (Author) , Wai-Yeung (University of Tokyo) Yip (Author)

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Ksh 26,400.00

Format: Hardback or Cased Book

ISBN-13: 9781108841214

Publisher: Cambridge University Press

Publication Date: Sep 30th, 2021

Weight: 752 grams

Dimension: 25.10 x 17.70 x 2.40 cms

Category: Circuits & components

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Synthesising fifteen years of research, this comprehensive text provides a treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, and practical considerations. An essential resource for researchers, professional engineers and graduate students.

Get Wireless Interface Technologies for 3D IC and Module Integration by Tadahiro (University of Tokyo) Kuroda at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by Cambridge University Press and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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