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Wireless Interface Technologies for 3D IC and Module Integration
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Wireless Interface Technologies for 3D IC and Module Integration

Book Details

Format Hardback
ISBN-10 110884121X
ISBN-13 9781108841214
Publisher Cambridge University Press
Imprint Cambridge University Press
Country of Manufacture GB
Country of Publication GB
Publication Date Sep 30th, 2021
Print length 336 Pages
Weight 752 grams
Dimensions 25.10 x 17.70 x 2.40 cms
KSh 24,650.00
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Synthesising fifteen years of research, this comprehensive text provides a treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, and practical considerations. An essential resource for researchers, professional engineers and graduate students.
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Get Wireless Interface Technologies for 3D IC and Module Integration by Tadahiro Kuroda, Wai-Yeung Yip at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Cambridge University Press and it has 336 pages.

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