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3D IC Devices, Technologies, and Manufacturing

By: Hong Xiao (Author)

Publisher Out of Stock

Ksh 17,800.00

Format: Paperback or Softback

ISBN-13: 9781510601468

Publisher: SPIE Press

Publication Date: Apr 30th, 2016

Dimension: 22.90 x 15.20 x 45.50 cms

Category: Circuits & components

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Discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; scaling trends of CMOS logic; and devices that may be used in the "post-CMOS" era.

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