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Encapsulation Technologies for Electronic Applications

By: Rice University) Ardebili Mechanical Engineering and Materials Science Department USA and visiting scholar University of Houston Haleh (Department of Mechanical Engineering (Author) , USA) Pecht University of Maryland Michael G. (CALCE (Center for Advanced Life Cycle Engineering) (Author)

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Ksh 33,000.00

Format: Hardback or Cased Book

ISBN-13: 9780815515760

Publisher: William Andrew Publishing

Publication Date: Jul 22nd, 2009

Weight: 914 grams

Dimension: 15.70 x 23.10 x 3.10 cms

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Offers a comprehensive discussion of encapsulants in electronic applications. This work emphasizes on the encapsulation of microelectronic devices. It discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants.

Get Encapsulation Technologies for Electronic Applications by Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) Ardebili at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by William Andrew Publishing and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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