Handbook of Semiconductor Interconnection Technology
Book Details
Format
Hardback
ISBN-10
1574446746
ISBN-13
9781574446746
Publisher
Taylor & Francis Inc
Imprint
CRC Press Inc
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Feb 22nd, 2006
Print length
536 Pages
Weight
1,112 grams
Product Classification:
Circuits & componentsElectronics: circuits and components
KSh 46,800.00
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Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy.
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.
What''s in this Edition:
Detailed discussion of electrochemical equipment for plating copper
Information on tools used for evaporation, chemical vapor deposition, and plasma processes
Emphasis on measurement of mechanical and thermal properties of insulators
Methods for characterizing porous dielectric thin films
Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides
Process schemes based on the increased need for borderless contact gates and source/drain
Expanded discussion on choices for low-dielectric insulators
Concentration on electroplated copper, especially morphology of plated films and their properties
Developments in thin film liners and barriers
Expanded material on copper reliability
What''s in this Edition:
Get Handbook of Semiconductor Interconnection Technology by Geraldine Cogin Shwartz at the best price and quality guaranteed only at Werezi Africa's largest book ecommerce store. The book was published by Taylor & Francis Inc and it has 536 pages.
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