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Handbook of Wafer Bonding

By: Ge) Ramm Peter (Fraunhofer Institut Munchen (Author) , USA) Lu NY Troy James Jian-Qiang (Rensellaer Polytechnic Institute (Author) , Norway) Taklo Oslo Maaike M. V. (SINTEF ICT (Author)

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Ksh 35,100.00

Format: Hardback or Cased Book

ISBN-13: 9783527326464

Publisher: Wiley-VCH Verlag GmbH

Publication Date: Jan 11th, 2012

Weight: 932 grams

Dimension: 24.60 x 17.70 x 2.40 cms

Category: Semi-conductors & super-conductors

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Filling a gap for a handbook and reference on recent developments in wafer bonding technology, an author and editor team from microsystems companies and industry-near research organizations presents reliable, first-hand information.

Get Handbook of Wafer Bonding by Peter (Fraunhofer Institut Munchen, Ge) Ramm at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by Wiley-VCH Verlag GmbH and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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