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Hardening Semiconductor Components Against Radiation and Temperature

By: William R. Dawes (Author)

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Ksh 0.00

Format: Hardback or Cased Book

ISBN-13: 9780815512127

Publisher: William Andrew Publishing

Publication Date: Dec 31st, 1990

Weight: 832 grams

Dimension: 18.50 x 26.40 x 2.90 cms

Category: Circuits & components

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Describes hardening of semiconductor components against radiation and temperature. This book discusses basic mechanisms of radiation effects on electronic materials and devices. It also discusses topics such as hardening technologies, circuit design for hardening, and, finally, and hardness assurance.

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