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Materials for Electronic Packaging

By: State University of New York.) Chung University at Buffalo Deborah D.L. (Composite Materials Research Laboratory (Author)

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Format: Hardback or Cased Book

ISBN-13: 9780750693141

Publisher: Elsevier Science & Technology

Publication Date: Mar 31st, 1995

Dimension: 23.50 x 15.90 x 73.00 cms

Category: Printing, packaging & reprographic industry

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Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. This title examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips.

Get Materials for Electronic Packaging by Deborah D.L. (Composite Materials Research Laboratory, University at Buffalo, State University of New York.) Chung at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by Elsevier Science & Technology and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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