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SemiConductor Wafer Bonding

By: China) Tong Nanjing Southeast University Germany Halle Max-Planck-Institute of Microstructure Physics North Carolina Durham Q.-Y. (Duke University (Author) , North Carolina) Goesele Durham Duke University Germany Halle U. (Max-Planck-Institute of Microstructure Physics (Author)

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Ksh 42,250.00

Format: Hardback or Cased Book

ISBN-13: 9780471574811

Publisher: John Wiley & Sons Inc

Publication Date: Dec 18th, 1998

Weight: 517 grams

Dimension: 24.60 x 16.40 x 2.00 cms

Category: Condensed matter physics

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Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.

Get SemiConductor Wafer Bonding by Q.-Y. (Duke University, Durham, North Carolina, Max-Planck-Institute of Microstructure Physics, Halle, Germany, Southeast University, Nanjing, China) Tong at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by John Wiley & Sons Inc and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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