The Technology of Wafers and Waffles I : Operational Aspects
Book Details
Format
Paperback / Softback
ISBN-10
0128094389
ISBN-13
9780128094389
Publisher
Elsevier Science Publishing Co Inc
Imprint
Academic Press Inc
Country of Manufacture
NL
Country of Publication
GB
Publication Date
May 18th, 2017
Print length
712 Pages
Weight
1,430 grams
Dimensions
19.10 x 23.30 x 3.40 cms
Product Classification:
Food & beverage technology
Ksh 28,800.00
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The Technology of Wafers and Waffles: Operational Aspects is the definitive reference book on wafer and waffle technology and manufacture. It covers specific ingredient technology (including water quality, wheat flour, starches, dextrins, oils and fats) and delves extensively into the manufacturing elements and technological themes in wafer manufacturing, including no/low sugar wafers, hygroscopic wafers, fillings and enrobing. The book explains, in detail, operating procedures such as mixing, baking, filling, cooling, cutting and packaging for every type of wafer: flat and shaped wafers for making biscuits, ice cream cones, cups, wafer reels, wafer sticks (flute wafers) and biscuit wafers. It also explores the various types of European (Belgian) waffles and North American frozen waffles.
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