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Three-Dimensional Molded Interconnect Devices (3D-MID)

By: Joerg Franke (Author)

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Ksh 39,150.00

Format: Hardback or Cased Book

ISBN-13: 9781569905517

Publisher: Hanser Publications

Publication Date: Apr 30th, 2014

Weight: 1001 grams

Dimension: 24.60 x 17.40 x 2.50 cms

Category: Plastics & polymers technology

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Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

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