3D IC Stacking Technology
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The latest advances in three-dimensional integrated circuit stacking technology
With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.
3D IC Stacking Technology covers:
- High density through silicon stacking (TSS) technology
- Practical design ecosystem for heterogeneous 3D IC products
- Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
- Process integration for TSV manufacturing
- High-aspect-ratio silicon etch for TSV
- Dielectric deposition for TSV
- Barrier and seed deposition
- Copper electrodeposition for TSV
- Chemical mechanical polishing for TSV applications
- Temporary and permanent bonding
- Assembly and test aspects of TSV technology
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