Guidebook for Managing Silicon Chip Reliability
Book Details
Format
Paperback / Softback
ISBN-10
0367400065
ISBN-13
9780367400064
Publisher
Taylor & Francis Ltd
Imprint
CRC Press
Country of Manufacture
GB
Country of Publication
GB
Publication Date
Oct 7th, 2019
Print length
224 Pages
Weight
453 grams
Product Classification:
Mechanical engineeringCircuits & components
Ksh 10,800.00
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Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. This book examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. It provides a framework for how to model the mechanism, test for defects, and avoid and manage damage. The authors focus on device failure and causes, outlines how to establish the specifications defining chip performance, cost, quality, and reliability, and they include an extensive table detailing the types of mechanism failures.
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.
This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?
Chapters discuss:
failure sites, operational loads, and failure mechanism
intrinsic device sensitivities
electromigration
hot carrier aging
time dependent dielectric breakdown
mechanical stress induced migration
alpha particle sensitivity
electrostatic discharge (ESD) and electrical overstress
latch-up
qualification
screening
guidelines for designing reliability
Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?
Chapters discuss:
Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
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